With the DRAM industry officially entering the EUV era, NAND flash memory stack technology has exceeded 150L
Technology Industry: Samsung, SK Hynix and Micron, the three major DRAM suppliers, will not only continue to transition to 1Znm and 1alpha nm process technologies, but will also formally introduce the EUV era, led by Samsung. DRAM suppliers will gradually replace them. Existing dual pattern technology to optimize its cost structure and manufacturing efficiency.
After NAND flash memory suppliers managed to push memory stacking technology to more than 100 layers in 2020, their goal is to reach 150 layers and above and increase the single-chip capacity from 256/512Gb to 512Gb/1Tb. Through the efforts of suppliers to optimize chip costs, consumers will be able to adopt higher-density NAND flash memory products.
Although PCIe Gen 3 is currently the main bus interface of SSD, since PCIe Gen 4 has been integrated into PS5, Xbox Series X/S and motherboards with Intel’s new microarchitecture, it will start to get more and more market share. The new interface is essential to meet the massive data transmission needs of high-end PCs, servers and HPC data centers.
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Mobile network operators will accelerate the construction of their 5G base stations, while Japan/South Korea is expected to achieve 6G
The “5G Implementation Guide: SA Option 2” issued by the GSMA in June 2020 provides an in-depth study of the technical details of 5G deployment, whether it is for mobile network operators or from a global perspective. Operators are expected to implement 5G independent architecture (SA) on a large scale in this year.
In addition to providing high-speed and high-bandwidth connections, the 5G SA architecture will also allow operators to customize their networks according to user applications and adapt to the required workloads with ultra-low latency.
However, even with the ongoing 5G deployment, Japan’s NTT DoCoMo and South Korea’s SK Telecom have already focused on 6G deployment because 6G supports various emerging applications in XR (including VR, AR, MR, and 8K and higher resolution). rate). , Realistic holographic communication, WFH, remote access, telemedicine,
With the development of AI-enabled devices in the direction of autonomous driving, the Internet of Things has developed into IoT intelligence
In this year, deep artificial intelligence integration will become the main value of the Internet of Things, and the definition of the Internet of Things will develop from the Internet of Things to the Internet of Things. Innovations in tools such as deep learning and computer vision will bring about a comprehensive upgrade of IoT software and hardware applications.
Taking into account industry dynamics, economic stimulus factors and remote access needs, it is expected that the Internet of Things will be adopted on a large scale in some major vertical areas (ie, smart manufacturing and smart healthcare).
Regarding smart manufacturing, the introduction of non-contact technology is expected to accelerate the arrival of Industry 4.0. As smart factories pursue resilience, flexibility and efficiency, artificial intelligence integration will provide higher accuracy and detection capabilities for edge devices such as collaborative robots and drones, thereby transforming automation into autonomy.
In terms of smart healthcare, AI can transform existing medical data sets into supporters of process optimization and service area expansion. For example, artificial intelligence integration provides faster thermal image recognition capabilities that can support clinical decision-making processes, telemedicine and surgical assistance applications.
These former applications are expected to serve as key functions realized by AI-supported medical IoT in various environments ranging from smart clinics to telemedicine centers.
The integration between AR glasses and smartphones will set off a wave of cross-platform applications
By this year ending, AR glasses will develop towards the design of connecting with smartphones, among which smartphones will become the computing platform of glasses. This design can significantly reduce the cost and weight of AR glasses. Especially as the 5G network environment becomes more mature in this year, the integration of 5G smartphones and AR glasses will enable the latter not only to run AR applications more smoothly.
This will also to achieve advanced individuals through the use of added computing The power of smart phones with audiovisual entertainment features. As a result, smartphone brands and mobile network operators are expected to enter the AR glasses market on a large scale.
The key part of autonomous driving, the popularity of driver monitoring systems (DMS) will rise sharply
Automotive safety technology has evolved from an application for automotive exteriors to an application for automotive interiors, and sensing technology is developing into the future, integrating driver status monitoring with external environmental readings. Similarly, automotive AI integration is evolving from its existing entertainment and user assistance functions to an indispensable driving force for automotive safety.
In view of a series of traffic accidents, drivers are ignoring road conditions due to excessive reliance on ADAS (advanced driver assistance systems), and the adoption rate has risen sharply recently, so the market is again focusing on driver monitoring functions. In the future, the main focus of the driver monitoring function will be on the development of more active, reliable and accurate camera systems.
Through iris tracking and behavior monitoring to detect the driver’s drowsiness and attention, these systems can recognize in real time whether the driver is tired, distracted or driving improperly. Therefore, DMS (Driver Monitoring System) has become an absolute requirement in the development of ADS (Autonomous Driving System), because DMS must provide multiple functions at the same time, including real-time detection / notification, driver capability assessment, and taking over driving control when necessary.
Vehicles with integrated DMS
Vehicles with integrated DMS are expected to be put into mass production in the near future. DMS (Driver Monitoring System) has become an absolute requirement in the development of ADS (Automatic Driving System), because DMS must provide multiple functions at the same time, including real-time detection/notification, driver capability evaluation, and taking over driving control when necessary.
Vehicles with integrated DMS are expected to be put into mass production in the near future. DMS (Driver Monitoring System) has become an absolute requirement in the development of ADS (Automatic Driving System), because DMS must provide multiple functions at the same time, including real-time detection/notification, driver capability evaluation, and taking over driving control when necessary. Vehicles with integrated DMS are expected to be put into mass production in the near future.
Foldable displays will be adopted by more devices to increase screen space
With the development of foldable phones from concept to product some years ago, certain smart phone brands have released their own foldable phones for testing. Although the sales performance of these phones is still moderate due to their relatively high cost (and thus extended to retail prices) so far, they can still cause a big sensation in the mature and saturated smartphone market.
In the next few years, as panel manufacturers gradually expand their flexible AMOLED production capacity, smart phone brands will continue to focus on the development of foldable phones. In addition, the popularity of foldable functions in other devices (especially notebook computers) is also increasing. Under the leadership of Intel and Microsoft, various manufacturers have released their own dual-display notebook products.
Similarly, foldable products with a single flexible AMOLED display will become the next hot topic. Laptops with foldable displays are likely to enter the market. As an innovative flexible display application and a product category with larger flexible displays than previous applications, the integration of foldable displays in notebook computers is expected to expand manufacturers’ flexible AMOLED production capacity. to some extent.
Mini LED and QD-OLED will become viable alternatives to white OLED
The competition among display technologies is expected to intensify in the high-end TV market. In particular, compared with current mainstream TVs, the mini LED backlight enables LCD TVs to better control their backlight area, so the display contrast is higher. Driven by the market leader, Samsung, LCD TVs with Mini LED backlights compete with similar white OLED TVs while offering similar specifications and performance.
In addition, in view of its excellent cost-effectiveness, Mini LED is expected to become a powerful substitute for white OLED display technology. On the other hand, Samsung Display (SDC) is betting on its new QD OLED technology as a point of technological difference with competitors, because SDC is terminating its LCD manufacturing business.
SDC hopes to establish a new gold standard in TV specifications through its QD OLED technology, which is superior to white OLED in terms of color saturation. TrendForce predicts that the 2H21 high-end TV market will show a fierce competitive landscape.
Advanced packaging will be fully developed in HPC and AiP
Despite the impact of the COVID-19 pandemic, the development of advanced packaging technology has not slowed down this year. As various manufacturers release HPC chips and AiP (packaged antenna) modules, semiconductor companies such as TSMC, Intel, ASE, and Amkor are also eager to participate in the booming advanced packaging industry.
With regard to HPC chip packaging, as these chips have increased demand for I/O lead density, the demand for interposers for chip packaging has also increased accordingly. TSMC and Intel respectively released their new chip packaging architecture, branded 3D fabric and hybrid bonding, and gradually developed the third-generation packaging technology (CoWoS for TSMC and EMIB for Intel) to the fourth-generation CoWoS and Co -EMIB technology.
In this year, the two fabs will hope to benefit from high-end 2.5D and 3D chip packaging needs. Regarding AiP module packaging, after Qualcomm released its first QTM product, MediaTek and Apple subsequently cooperated with related OSAT companies, including ASE and Amkor. Through these collaborations, MediaTek and Apple hope to make progress in the development of mainstream flip chip packaging, which is a relatively low-cost technology.
Advanced Inspection and Prevention (AiP)
AiP is expected to be gradually integrated into 5G mmWave equipment. Driven by the demand for 5G communications and network connectivity, AiP modules are expected to enter the smartphone market first, and then into the automotive and tablet computer markets. After Qualcomm released its first QTM product, MediaTek and Apple subsequently cooperated with related OSAT companies, including ASE and Amkor.
Through these collaborations, MediaTek and Apple hope to make progress in the development of mainstream flip chip packaging, which is a relatively low-cost technology. AiP is expected to be gradually integrated into 5G mmWave equipment starting 2 years ago and continuing this year. Driven by the demand for 5G communications and network connectivity, AiP modules are expected to enter the smartphone market first, and then into the automotive and tablet computer markets.
After Qualcomm released its first QTM product in 2018, MediaTek and Apple subsequently cooperated with related OSAT companies, including ASE and Amkor. Through these collaborations, MediaTek and Apple hope to make progress in the development of mainstream flip chip packaging, which is a relatively low-cost technology
AiP is expected to be gradually integrated into 5G mmWave equipment starting 2yrs ago and moving forward in this year. Driven by the demand for 5G communications and network connectivity, AiP modules are expected to enter the smartphone market first, and then into the automotive and tablet computer markets.
Chip manufacturers will seek share in the AIoT market through accelerated expansion strategies
With the rapid development of the Internet of Things, 5G, artificial intelligence and cloud/edge computing, the strategy of chip manufacturers has evolved from a single product to a product lineup, and then to product solutions, thus creating a comprehensive and detailed chip ecosystem.
Looking at the development of major chip manufacturers from a broad perspective in recent years, the continued vertical integration of these companies has led to an oligopolistic industry in which localized competition is more intense than ever.
In addition, as the commercialization of 5G generates diversified application requirements for various use cases, chip manufacturers are now providing full-service vertical solutions, from chip design to software/hardware platform integration to cope with the huge development of AIoT. Business opportunity industry. on the other hand,
Active matrix Micro LED TV will debut in the consumer electronics market
The large-scale Micro LED displays released by Samsung, LG, Sony and Lumen in recent years marked the beginning of the integration of Micro LED in the development of large-scale displays. As the application of Micro LED in large-size displays matures, Samsung is expected to become the first company in the industry to release active matrix Micro LED TVs.
Therefore, this year is set as the first year of Micro LED integration in TVs. The active matrix uses the TFT glass substrate of the display to address pixels, and since the IC design of the active matrix is relatively simple, the number of wiring required by this addressing scheme is relatively small.
In particular, active matrix driver ICs require PWM functions and MOSFET switches in order to stably drive the current of the Micro LED display, and therefore require new and extremely expensive R&D processes for such ICs. Therefore, for Micro LED manufacturers, the biggest challenge for Micro LEDs to the terminal equipment market is technology and cost.
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